Optical Lithography (OLITHO)5 ECTS
(englische Bezeichnung: Optical Lithography)
(Prüfungsordnungsmodul: Optical Lithography: Technology, Physical Effects and Modeling)

Lehrveranstaltungen:

• • Optical Lithography: Technology, Physical Effects, and Modelling
    (Vorlesung, 2 SWS, Andreas Erdmann, Do, 10:15 - 11:45)
  • Übung zu Optical Lithography
    (Übung, 2 SWS, Andreas Erdmann, Di, 16:15 - 17:45, BR 1.161)

Empfohlene Voraussetzungen:

• abgeschlossens Grundstudium / B.Sc.

• Grundlagen der Optik und Elektotechnik
  

Inhalt:

Semiconductor lithography covers the process of pattern transfer from a mask/layout to a photosensitive layer on the surface of a wafer. It is one of the most critical steps in the fabrication of microelectronic circuits. The majority of semi-conductor chips are fabricated by optical projection lithogra-phy. Other lithographic techniques are used to fabricate litho-graphic masks or new optical and mechanical devices on the micro- or nanometer scale. Innovations such as the introduc-tion of optical proximity correction OPC), phase shift masks (PSM), special illumination techniques, chemical amplified resist (CAR) materials, immersion techniques have pushed the smallest feature sizes, which are produced by optical pro-jection techniques, from several wavelengths in the early 80ties to less than a quarter of a wavelength nowadays. This course reviews different types of optical lithographies and compares them to other methods. The advantages, disad-vantages, and limitations of lithographic methods are dis-cussed from different perspectives. Important components of lithographic systems, such as masks, projection systems, and photoresist will be described in detail. Physical and chemical effects such as the light diffraction from small features on ad-vanced photomasks, image formation in high numerical aper-ture systems, and coupled kinetic/diffusion processes in mod-ern chemical amplified resists will be analysed. The course includes an in-depth introduction to lithography simulation which is used to devise and optimize modern lithographic processes.

Lernziele und Kompetenzen:

The goals of this lecture are • understand the principles of optical projection lithography • learn how optical resolution enhancements work • get an overview on alternative lithographic techniques • get an introduction to lithography simulation • understand the role of nanoscale light scattering effects

Literatur:

• C. Mack: "Fundamental principles of optical lithography: The science of microfabrication", John Wiley & Sons, 2007.

• O. Okoroanyanwu: "Chemistry and Lithography", SPIE press 2012.

• H.J. Levinson: “Principles of lithography”, SPIE Press, 2011.

• A. Erdmann, T. Fuehner, P. Evanschitzky, V. Agudelo, C. Freund, P. Michalak, D. Xu: „Optical and EUV projection lithography: A computational view” (invited for 30 years special edition), Microelectronic Engineering 132 (2015) 21-34.
  

Verwendbarkeit des Moduls / Einpassung in den Musterstudienplan:

1. Advanced Optical Technologies (Master of Science)
   (Po-Vers. 2018w | TechFak | Advanced Optical Technologies (Master of Science) | Gesamtkonto | Major Topics | Optical Material Processing | Optical Lithography: Technology, Physical Effects and Modeling)
2. Advanced Optical Technologies (Master of Science)
   (Po-Vers. 2018w | TechFak | Advanced Optical Technologies (Master of Science) | Gesamtkonto | Major Topics | Optical Materials and Systems | Optical Lithography: Technology, Physical Effects and Modeling)

Studien-/Prüfungsleistungen:

Optical Lithography: Technology, Physical Effects and Modeling (Prüfungsnummer: 21401)

(englischer Titel: Optical Lithography: Technology, Physical Effects and Modeling)

Prüfungsleistung, mündliche Prüfung, Dauer (in Minuten): 30, benotet, 5 ECTS

Anteil an der Berechnung der Modulnote: 100.0 %

Erstablegung: WS 2020/2021, 1. Wdh.: SS 2021

1. Prüfer:

Andreas Erdmann